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Intel launches Lakefield Hybrid CPUs with "Foveros 3D Stacking" for low-power devices & foldable dual-screen PCs

Posted By on June 11th, 2020
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www.dsogaming.com
Intel finally brings 3D processors by launching hybrid "Lakefield" chips. Lakefield is the first mobile processor from Intel to use their Foveros 3D packaging technology.
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